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3M™ Scotch-Weld™ Structural Adhesive Film AF 163-3M .03 is a non-woven supporting carrier (Matte). This thermosetting, modified epoxy structural adhesive film is designed for both solid panel and honeycomb sandwich constructions.

Vac‐Pak HS8171 is a hydrophilic material. It is a clear green, heat stabilised, blown nylon 6 v-fold film. Vac‐Pak HS8171 has excellent tensile strength and heat ageing properties, having been succesfully used at pressures of 100PSI (6.9bar) and temperatures of up to 400°F (204°C).

LOCTITE EA 7000 AERO (Known as Hysol PL7000) is an epoxy film adhesive for composite bonding applications. It provides excellent performance properties in composite bonding and has excellent results on composite surfaces.

FM 377 film adhesive is a 350°F cure modified epoxy designed for continuous services at 350°F. FM 377 film adhesive provides outstanding durability in bonding metallic and non-metallic substrates, and in the co-cure or secondary bonding of composites structures.

LOCTITE EA 9658 AERO (EA 9658 .100 NWG) is a new technology, nacelle film adhesive. It combines high temperature strength controlled flow to minimize hole blockage and flash/flow clean up in the shop.

LOCTITE EA 7000 AERO (Known as Hysol PL7000) is an epoxy film adhesive for composite bonding applications. It provides excellent performance properties in composite bonding and has excellent results on composite surfaces.

3M™ Surface Pre-Treatment AC-131 is a water based surface pre-treatment used to enhance adhesion between organic coating and metallic surfaces.

3M™ Surface Pre-Treatment AC-130-2 is high performance surface preparation for adhesive bonding. This product promotes enhanced adhesion as a result of the chemical interaction at the interfaces.

3M™ Surface Pre-Treatment AC-130-2 is high performance surface preparation for adhesive bonding. This product promotes enhanced adhesion as a result of the chemical interaction at the interfaces.

LOCTITE EA 460 AERO (Known as Hysol PL 460) is a foaming epoxy adhesive in paste form that used for splicing honeycomb core edge closeouts and core filling.